Materials Engineering
About This Innovation
The Invention
Key Information
Category:
Materials Science
Completion Status:
yes
Patent Number:
10987388; 10766798; 10751423; 10598914; 10456774; 10442982; 10276309; 10199588; 9082554; 9029286; 8969252; 8859456; 8846190; 8592551; 10041951; 9805841; 9590278; 9559360; 9274108; 9082554; 9029286; 8969252; 8859456; 8846190; 8592551; 8535506; 8523044; 8470611; 8450247; 83722949; 8283325;8201724; 8088982; 7923109; 7598344; 7488593; 7374893; 7332321; 11576608; 11508968; 9550809; 9527741; 8986999; 8865347; 8685323; 8569226; 8431506; 7960721; 7923109
Co-Inventor:
Uyanga Tsedev; Fred Lam; George Le-Le Sun; Paiman Peter Ghoroghchian; Ruogu Qi; Xiangnan Dang; Zhimin Tao; Andrew M. Siegel; Nandini Rajan; Neelkanth M. Bardhan; Nurxat Nuraje; Yu Lei; Nuraje Lei; Hiroshi Atsumi; Xunpei Liu; Jifa Qi; Paula T. Hammond; Matthew T. Klug; Hyunyung Yi; Debadyuti Ghosh; Michael S. Strano; Noemie-Manuelle Dorval Courchesne; Po-Yen Chen; Paula T. Hammond-Cunningham; Ki Tae Nam; Chung-Yi Chiang; Pil J. Yoo; Soo-Kwan Lee; Juhyun Park; Brian Neltner; Brian D. Reiss; Chuanbin Mao; Daniel J. Solis; Beau R. Peele; Asher K. Senensky;Deng Soo Yun; Karl Dane Wittrup; Eric Krauland;Christine J. Schmidt; Kiley P. H. Miller; Archit Sanghvi; Andrew Parsons Magyar; Daeyeon Lee; Jin-Woong Kim; David Weitz; Evelyn Hu; Xia Quan; Hash Pakbaz;
Patent Information
Patent Number: 10987388; 10766798; 10751423; 10598914; 10456774; 10442982; 10276309; 10199588; 9082554; 9029286; 8969252; 8859456; 8846190; 8592551; 10041951; 9805841; 9590278; 9559360; 9274108; 9082554; 9029286; 8969252; 8859456; 8846190; 8592551; 8535506; 8523044; 8470611; 8450247; 83722949; 8283325;8201724; 8088982; 7923109; 7598344; 7488593; 7374893; 7332321; 11576608; 11508968; 9550809; 9527741; 8986999; 8865347; 8685323; 8569226; 8431506; 7960721; 7923109
Technical Specifications
Collaboration
Co-Inventor: Uyanga Tsedev; Fred Lam; George Le-Le Sun; Paiman Peter Ghoroghchian; Ruogu Qi; Xiangnan Dang; Zhimin Tao; Andrew M. Siegel; Nandini Rajan; Neelkanth M. Bardhan; Nurxat Nuraje; Yu Lei; Nuraje Lei; Hiroshi Atsumi; Xunpei Liu; Jifa Qi; Paula T. Hammond; Matthew T. Klug; Hyunyung Yi; Debadyuti Ghosh; Michael S. Strano; Noemie-Manuelle Dorval Courchesne; Po-Yen Chen; Paula T. Hammond-Cunningham; Ki Tae Nam; Chung-Yi Chiang; Pil J. Yoo; Soo-Kwan Lee; Juhyun Park; Brian Neltner; Brian D. Reiss; Chuanbin Mao; Daniel J. Solis; Beau R. Peele; Asher K. Senensky;Deng Soo Yun; Karl Dane Wittrup; Eric Krauland;Christine J. Schmidt; Kiley P. H. Miller; Archit Sanghvi; Andrew Parsons Magyar; Daeyeon Lee; Jin-Woong Kim; David Weitz; Evelyn Hu; Xia Quan; Hash Pakbaz;